Electronic device and method for manufacturing electronic device

The invention relates to an electronic device (100), comprising: a housing body (2) having a chamber (20) in which an electronic semiconductor chip (1) is mounted; and a cover element (3) filled into the chamber and covering the semiconductor chip, the chamber having a side wall (22) facing the semiconductor chip and surrounding the semiconductor chip in the lateral direction, the cover element is in direct mechanical contact with the side wall in at least one attachment region and is directly attached to the housing body in the at least one attachment region, and the housing body has at least one anchoring structure (4), the anchoring structure is configured and designed to reduce the tendency of the cover element to delaminate from the housing body in the at least one attachment region. A method for producing an electronic device (100) is also proposed. 提出一种电子设备(100)，其具有：具有腔室(20)的壳体本体(2)，电子半导体芯片(1)安装在所述腔室中；和覆盖元件(3)，所述覆盖元填充到腔室中并且覆盖半导体芯片，其中腔室具有面向半导体芯片并在横向方向上围绕半导体芯片的侧壁(22)，覆盖元件在至少一个附着区域中与侧壁直接机械接触并且在至少一个附着区域中直接