Resin laminate for packaging material

Provided is a resin laminate for packaging materials, which is characterized in that a base material layer and a sealant layer are formed from the same material and which has good processability. A resin laminate for a packaging material, which is provided with at least a base material layer and a s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAGA ATSUSHI, TANEKI KENSUKE, IMAI TORU, HAMANO AKITO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Provided is a resin laminate for packaging materials, which is characterized in that a base material layer and a sealant layer are formed from the same material and which has good processability. A resin laminate for a packaging material, which is provided with at least a base material layer and a sealant layer, the main components of the resin compositions constituting the base material layer and the sealant layer being composed of the same resin composition, and the welding initiation temperature (FIT-B) of the base material layer and the sealing initiation temperature (SIT-S) of the sealant layer satisfying the following formulae (1)-(3). Formula (1): 50 DEG C < = (FIT-B)-(SIT-S) < = 90 (DEG C): 90 < = (SIT-S) < = 120 (DEG C) Formula (2): 160 < = (FIT-B) < = 180 (DEG C) Formula (3). 提供特征在于基材层和密封层由相同的原材料形成的加工性良好的包装材料用树脂层叠体。一种包装材料用树脂层叠体,其至少具备基材层和密封层,构成前述基材层和前述密封层的树脂组合物的主要成分由相同的树脂组合物构成,基材层的熔接起始温度(FIT-B)和密封层的密封起始温度(SIT-S)满足下述式(1)~(3)。50℃≤(FIT-B)-(SIT-S)≤90(℃)式(1)90≤(SIT-S)≤120(℃)式(2)160≤(FIT-B)≤180(℃)式(3)。