Lead frame and semiconductor product packaging structure

The invention discloses a lead frame, which comprises a slide island, a first pin welding area, a second pin welding area and a waterproof structure, and is characterized in that the top surface of the slide island is a chip mounting surface and is used for mounting a semiconductor product chip; the side surface of the slide island is provided with a first pin used for leading out a first electrode of a semiconductor product chip, and the side surface of the first pin welding area is provided with a second pin used for leading out a second electrode of the semiconductor product chip. A third pin for leading out a third electrode of the semiconductor product chip is arranged on the side surface of the second pin welding area; and the waterproof structure adopts a V-shaped groove surrounding the peripheral side of the slide island and the peripheral edges of the first pin welding area and the second pin welding area. The depth of the V-shaped groove is designed depth obtained through reliability data accumulati