Semiconductor packaging method and packaging structure

The invention discloses a semiconductor packaging method and a semiconductor packaging structure, and relates to the technical field of semiconductors, the semiconductor packaging structure comprises a lower substrate and an upper substrate, the top of the lower substrate is provided with a third embedding groove, a second embedding groove and a first embedding groove, a SAW filter and an IDT function area are fixedly connected to the bottom of the upper substrate and located in the third embedding groove and the first embedding groove respectively, and a semiconductor is arranged in the second embedding groove. Through mutual cooperation of a pull rod, a first groove, an L-shaped block, a second groove, a connecting rod, a third groove, a fourth groove, a clamping block and a spring, the situation that the lower base and the upper base are separated in the using process can be effectively avoided, and the fixing stability between the lower base and the upper base can be effectively enhanced through connectio