Substrate processing apparatus

The invention relates to a substrate processing apparatus and method. The substrate processing apparatus includes a first drying unit configured to perform a first drying process using a drying fluid on a substrate on which a liquid film is formed; a first fluid supply unit configured to supply a drying fluid to the first drying unit; a second drying unit configured to perform a second drying process using the drying fluid on the substrate on which the first drying process is performed; a second fluid supply unit configured to supply a drying fluid to the second drying unit; a first door configured to control opening and closing of the first drying unit; and a second door configured to control opening and closing of the second drying unit, in which the first door is opened when a pressure in the first drying unit reaches a first transfer pressure, and the second door is opened when a pressure in the second drying unit reaches a second transfer pressure. 本公开涉及一种基板加工装置和方法。该基板加工装置包括第一干燥单元，该第一干燥单元配置为在其上形成有液膜的基板上使