ELECTRONIC COMPONENT, PRESSURE VALUE DETECTION METHOD, AND ELECTRONIC COMPONENT MANUFACTURING METHOD

The invention relates to an electronic component, a pressure value detection method and a manufacturing method of the electronic component. The purpose of the present disclosure is to detect a pressure value in a first frequency band and to detect a pressure value in a second frequency band higher than the first frequency band. The pressure sensor is provided with a cavity, a thin film which is deformed according to the difference between the pressure inside the cavity and the pressure outside the cavity, and an application specific integrated circuit (ASIC). The film includes an opposing portion opposing the cavity. Either the peripheral portion of the facing portion or the central portion of the facing portion is a thin portion, and the other is a thick portion thicker than the thin portion. The ASIC detects a pressure value in the first frequency band on the basis of the first output value in the thin portion. In addition, the ASIC detects a pressure value in a second frequency band, which is higher than t