Preparation method of heat-conducting single-component organic silicon adhesive

The invention relates to the technical field of organic silicon adhesives, and discloses a preparation method of a heat-conducting single-component organic silicon adhesive which comprises the following components in parts by weight: 200-300 parts of A-type organic silicon resin, 100-200 parts of heat-conducting filler, 2-5 parts of a coloring agent, 5-7 parts of a cross-linking agent, 1-5 parts of an auxiliary agent, 2-10 parts of an adhesive, 10-30 parts of a filling agent and 1-5 parts of a stabilizer. Wherein the required adding amount of the cross-linking agent needs to be determined according to the type of the organic silicon resin and a reaction formula of the cross-linking agent. The preparation method of the heat-conducting single-component organic silicon adhesive has relatively simple preparation steps, is easy to operate and control, reduces the preparation complexity and difficulty, is shorter in curing time, and is more efficient compared with the existing method. This means that a cured sample