Plywood with low formaldehyde release and preparation method thereof
The invention discloses plywood with low formaldehyde release and a preparation method thereof. Wood boards are bonded through an adhesive to form a board blank, then the board blank is subjected to hot pressing, and the plywood is obtained. The adhesive is prepared from the following components in...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses plywood with low formaldehyde release and a preparation method thereof. Wood boards are bonded through an adhesive to form a board blank, then the board blank is subjected to hot pressing, and the plywood is obtained. The adhesive is prepared from the following components in parts by weight: 300 to 600 parts of urea-formaldehyde resin, 10 to 30 parts of filler, 20 to 50 parts of formaldehyde absorbent, 10 to 20 parts of flame retardant, 10 to 20 parts of plasticizer and 3 to 5 parts of mildew preventive. The prepared plywood is low in formaldehyde emission and high in bonding strength, the bonding strength of an adhesive is improved by adopting silicon carbide and the soda-lime powder as the composite filler, and the prepared plywood is lower in formaldehyde emission by adopting the pomelo peel powder and the sunflower head powder as the composite formaldehyde absorbent.
本发明公开了一种低甲醛释放的胶合板及其制备方法。由木板经过胶黏剂粘结后制成板坯,然后对板坯进行热压,得到胶合板。胶黏剂包括如下重量份数的组分:脲醛树脂300-600份、填料10-30份、甲醛吸收剂20-50份、阻燃剂10-20份、增 |
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