REWIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Provided is a rewiring substrate for electrically connecting a first electrical element and a second electrical element, the rewiring substrate being provided with: a first insulating layer (2) having a first main surface and a second main surface facing in opposite directions to each other; a first terminal section formed so as to be exposed on a first main surface of the first insulating layer (2); a second terminal section formed so as to be exposed on the second main surface of the first insulating layer; a conductor layer that connects the first terminal section and the second terminal section within the first insulating layer; a metal support body which is formed on the first main surface of the first insulating layer and has an opening; and a second insulating layer formed on the inner surface of the opening of the metal support. 本发明提供一种再布线基板，其用于将第一电要素与第二电要素电连接，该再布线基板具备：第一绝缘层(2)，其具有相互朝向相反方向的第一主面以及第二主面；第一端子部，其形成为在第一绝缘层(2)的第一主面露出；第二端子部，其形成为在第一绝缘层的第二主面露出；导体层，其在第一绝缘层内将第一端子部与第二端子部连接；金属支承体，其形成于第一绝缘层的第一主面上，且具