SEMICONDUCTOR PACKAGE DEVICE

A semiconductor packaging device comprises a packaging module, a heat dissipation cover and a thermal interface material layer. The packaging module comprises a substrate and a working wafer, and the working wafer is welded on one surface of the substrate. The heat dissipation cover comprises a meta...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN YANZHAO, YANG QIMING, YANG SHENGFAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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