SEMICONDUCTOR PACKAGE DEVICE

A semiconductor packaging device comprises a packaging module, a heat dissipation cover and a thermal interface material layer. The packaging module comprises a substrate and a working wafer, and the working wafer is welded on one surface of the substrate. The heat dissipation cover comprises a metal cover body, a containing groove and a plurality of protruding columns. The metal cover body is fixed on the surface of the substrate and covers the working wafer. The accommodating groove is positioned on one surface, facing the working wafer, of the metal cover body and is used for accommodating the working wafer, and the convex columns are respectively positioned on the metal cover body and are distributed in the accommodating groove at intervals; the depth of the containing groove is larger than the height of each protruding column, and the area of the containing groove is larger than the area of the working wafer. And the thermal interface material layer is in a non-solid state, is positioned in the accommoda