High-stability electronic copper paste and preparation method thereof

The invention provides high-stability electronic copper paste and a preparation method thereof, and the preparation method comprises the following steps: (1) forming an adsorption layer on the surface of copper powder or block copper, the adsorption layer containing a class A reagent; the content of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PENG YIXIAO, WANG CHONG, LI JIUJUAN, WANG SHOUXU, ZHOU GUOYUN, HONG YAN, CHEN YUANMING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!