High-stability electronic copper paste and preparation method thereof

The invention provides high-stability electronic copper paste and a preparation method thereof, and the preparation method comprises the following steps: (1) forming an adsorption layer on the surface of copper powder or block copper, the adsorption layer containing a class A reagent; the content of the copper powder or block copper in the B-type solvent is 0.5-100g/L; (2) adding the copper powder or block copper on which the adsorption layer is formed into a B-type solvent and a C-type catalyst, wherein the content of the A-type reagent in the B-type solvent is 0.1-50g/L; the content of the C-type catalyst in the B-type reagent is 0.05-1g/L, and the A-type reagent is selected from low-boiling-point organic acids, alcohols, aldehydes and metal salts thereof; the autocatalytic protective film formed by the method is high in oxidation resistance and long in protection period; the formed autocatalytic protective film can be decomposed at a relatively low sintering temperature; the autocatalytic protective film i