High-stability electronic copper paste and preparation method thereof
The invention provides high-stability electronic copper paste and a preparation method thereof, and the preparation method comprises the following steps: (1) forming an adsorption layer on the surface of copper powder or block copper, the adsorption layer containing a class A reagent; the content of...
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| creator | PENG YIXIAO WANG CHONG LI JIUJUAN WANG SHOUXU ZHOU GUOYUN HONG YAN CHEN YUANMING |
| description | The invention provides high-stability electronic copper paste and a preparation method thereof, and the preparation method comprises the following steps: (1) forming an adsorption layer on the surface of copper powder or block copper, the adsorption layer containing a class A reagent; the content of the copper powder or block copper in the B-type solvent is 0.5-100g/L; (2) adding the copper powder or block copper on which the adsorption layer is formed into a B-type solvent and a C-type catalyst, wherein the content of the A-type reagent in the B-type solvent is 0.1-50g/L; the content of the C-type catalyst in the B-type reagent is 0.05-1g/L, and the A-type reagent is selected from low-boiling-point organic acids, alcohols, aldehydes and metal salts thereof; the autocatalytic protective film formed by the method is high in oxidation resistance and long in protection period; the formed autocatalytic protective film can be decomposed at a relatively low sintering temperature; the autocatalytic protective film i |
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the content of the copper powder or block copper in the B-type solvent is 0.5-100g/L; (2) adding the copper powder or block copper on which the adsorption layer is formed into a B-type solvent and a C-type catalyst, wherein the content of the A-type reagent in the B-type solvent is 0.1-50g/L; the content of the C-type catalyst in the B-type reagent is 0.05-1g/L, and the A-type reagent is selected from low-boiling-point organic acids, alcohols, aldehydes and metal salts thereof; the autocatalytic protective film formed by the method is high in oxidation resistance and long in protection period; the formed autocatalytic protective film can be decomposed at a relatively low sintering temperature; the autocatalytic protective film i</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240625&DB=EPODOC&CC=CN&NR=118248376A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240625&DB=EPODOC&CC=CN&NR=118248376A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PENG YIXIAO</creatorcontrib><creatorcontrib>WANG CHONG</creatorcontrib><creatorcontrib>LI JIUJUAN</creatorcontrib><creatorcontrib>WANG SHOUXU</creatorcontrib><creatorcontrib>ZHOU GUOYUN</creatorcontrib><creatorcontrib>HONG YAN</creatorcontrib><creatorcontrib>CHEN YUANMING</creatorcontrib><title>High-stability electronic copper paste and preparation method thereof</title><description>The invention provides high-stability electronic copper paste and a preparation method thereof, and the preparation method comprises the following steps: (1) forming an adsorption layer on the surface of copper powder or block copper, the adsorption layer containing a class A reagent; 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the content of the copper powder or block copper in the B-type solvent is 0.5-100g/L; (2) adding the copper powder or block copper on which the adsorption layer is formed into a B-type solvent and a C-type catalyst, wherein the content of the A-type reagent in the B-type solvent is 0.1-50g/L; the content of the C-type catalyst in the B-type reagent is 0.05-1g/L, and the A-type reagent is selected from low-boiling-point organic acids, alcohols, aldehydes and metal salts thereof; the autocatalytic protective film formed by the method is high in oxidation resistance and long in protection period; the formed autocatalytic protective film can be decomposed at a relatively low sintering temperature; the autocatalytic protective film i</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | High-stability electronic copper paste and preparation method thereof |
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