Low-temperature curing copper-based slurry and preparation method thereof

The invention provides low-temperature curing copper-based slurry and a preparation method thereof. The copper-based slurry comprises the following components in parts by weight: 60-75 parts of conductive particles; 25-40 parts by weight of an organic phase; wherein the conductive particles comprise the following components in percentage by weight: 60-80 wt% of micron copper powder; the PVP coated nano copper powder is 10 to 20 weight percent; 10-20 wt% of nano silver coated copper powder, wherein wt% is the percentage of the weight of each component included in the conductive particles to the total weight of the conductive particles; wherein the diameter range of the micron copper powder is 1-2 microns, and the size of the PVP coated nano copper powder and the size of the nano silver coated copper powder are nanoscale. By compounding the micron copper powder, the PVP-coated nano copper powder and the nano silver-coated copper powder, the PVP-coated nano copper powder is used for partially replacing the nano