Electrolytic copper foil additive with high tensile strength, electrolytic copper foil and preparation method

The invention provides a high-tensile-strength electrolytic copper foil additive, an electrolytic copper foil and a preparation method, and belongs to the technical field of electrolytic copper foils. The electrolytic copper foil additive comprises the following raw material components in percentage by weight: 1 to 10 mg/L of thiourea compound, 15 to 40 mg/L of organic sulfide, 15 to 25 mg/L of organic nitride and 5 to 30 mg/L of nonionic water-soluble polymer. According to the present invention, the electrolytic copper foil made of the additive added by controlling the concentration of the thioureido compound has a tensile strength of 47-80 kgf/mm2, and the electrolytic copper foil rarely suffers from defects such as water ripples, wrinkles and breakage in an RTR process, thereby ensuring high productivity and yield. 提供一种高抗拉强度电解铜箔添加剂、电解铜箔及制备方法，属于电解铜箔技术领域。其中，该电解铜箔添加剂包括以下重量比的原料组分：硫脲类化合物的含量为1～10mg/L，有机硫化物含量为15～40mg/L，有机氮化物含量为15～25mg/L，非离子水溶性聚合物含量为5～30mg/L。本发明通过控制硫脲基化合物浓度而加入的添加剂制成的电解铜箔具有47-80kgf/mm2的抗拉强度,该电解铜箔在R