High-thermal-conductivity epoxy molding compound for semiconductor packaging and preparation method of high-thermal-conductivity epoxy molding compound

The invention relates to the field of high polymer materials, and particularly discloses a high-thermal-conductivity epoxy molding compound for semiconductor packaging and a preparation method thereof. The invention discloses a high-thermal-conductivity epoxy molding compound for semiconductor packaging. The high-thermal-conductivity epoxy molding compound is prepared from the following raw materials in parts by weight: 100-120 parts of epoxy resin, 20-30 parts of a curing agent, 5-10 parts of a toughening agent, 0.3-0.5 part of an accelerant, 700-900 parts of heat-conducting filler and 2-5 parts of a silane coupling agent, the heat-conducting filler comprises aluminum nitride powder, hollow boron nitride powder and graphene aerogel powder in a mass ratio of 1: (0.3-0.5): (0.5-0.7); the graphene aerogel powder is prepared from graphene oxide, aramid fiber and carboxylated nanocellulose according to the mass ratio of 1: (0.5 to 0.8): (0.1 to 0.3). The epoxy heat sealing material has the advantages of being goo