System and method for thinning wafer substrate

Embodiments of the invention provide a wafer processing system comprising a processing tool comprising at least one abrasive member for removing material from a wafer substrate; an electrolyte supply line for supplying an electrolyte to the wafer substrate; a holding module for holding the wafer sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LAN KUNZHI, FAN ZHIWEN, YANG YAOGUANG, CHEN ZHAOZHANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POLISHING PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL TRANSPORTING WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL
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