System and method for thinning wafer substrate

Embodiments of the invention provide a wafer processing system comprising a processing tool comprising at least one abrasive member for removing material from a wafer substrate; an electrolyte supply line for supplying an electrolyte to the wafer substrate; a holding module for holding the wafer substrate, the holding module comprising an electrically conductive base and an electrically conductive porous member positioned on a top surface of the electrically conductive base, a vacuum source in fluid communication with a fluid channel formed in the electrically conductive base to generate a vacuum to hold the wafer substrate on the electrically conductive porous member; an actuator module for driving rotation of the grinding member and rotation of the conductive base; and a power supply module for applying a current through the conductive base to the grinding member and the conductive porous member. The material on the wafer substrate is removed through the grinding component after being converted into the oxi