Circuit board, electronic module, and wiring method for circuit board

A circuit board (1) according to the present invention is provided with: a wide copper wire (4) laid on an electronic component (2) having high power on a mounting surface (1a) of the circuit board (1) on which electronic components (2, 3a, 3b) are mounted; a plating layer (5) formed on the non-mounting surface (1b) of the circuit board (1) on which the electronic component (2, 3a, 3b) is not mounted, the plating layer (5) being formed over the entire non-mounting surface (1b) or over a part of the non-mounting surface (1b); and a plurality of pads (6) which are formed on the plating layer (5) by means of soldering tin in a matrix structure that is closely arranged in a staggered manner so that the plurality of pads (6) cover the entire plating layer (5). 本发明所涉及的电路基板(1)具有：宽铜线(4)，在电路基板(1)的用于安装电子元器件(2、3a、3b)的安装面(1a)上，该宽铜线(4)铺设在功率较大的电子元器件(2)处；镀敷层(5)，在电路基板(1)的未安装电子元器件(2、3a、3b)的非安装面(1b)上，该镀敷层(5)形成在整个非安装面(1b)或非安装面(1b)的局部；以及多个焊盘(6)，该多个焊盘(6)在镀敷层(5)上利用焊锡形成为紧密且交错地排列的矩阵结构，以使多个焊盘(6)覆盖整个镀敷层(5)。