Electronic device
The invention discloses an electronic device. The description relates to a device comprising a first chip (20) and a second chip (36), the first chip (20) comprising an electronic circuit and the second chip (36) comprising a capacitor (18) having a density greater than 700 nF/mm2, the first chip an...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention discloses an electronic device. The description relates to a device comprising a first chip (20) and a second chip (36), the first chip (20) comprising an electronic circuit and the second chip (36) comprising a capacitor (18) having a density greater than 700 nF/mm2, the first chip and the second chip being bonded to each other by molecular bonding.
本发明公开了电子器件。本描述涉及一种包括第一芯片(20)和第二芯片(36)的器件，第一芯片(20)包括电子电路，并且第二芯片(36)包括密度大于700nF/mm^2的电容器(18)，第一芯片和第二芯片通过分子键合彼此键合。 |
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