SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

In one example, an electronic device includes a substrate including a first side and a second side opposite the first side, where the substrate includes a first recess at the second side of the substrate; a first electronic component over the first side of the substrate; and a resin in the first groove. The substrate includes a floating pad at the first side of the substrate, a second groove at the first side of the substrate, and a third groove at the first side of the substrate, wherein the floating pad is between the second groove and the third groove. Other examples and related methods are also disclosed herein. 在一个实例中，一种电子装置包括：衬底，其包括第一侧和与所述第一侧相对的第二侧，其中所述衬底包括在所述衬底的所述第二侧处的第一凹槽；第一电子组件，其在所述衬底的所述第一侧上方；以及树脂，其在所述第一凹槽中。所述衬底包括在所述衬底的所述第一侧处的浮动衬垫、在所述衬底的所述第一侧处的第二凹槽，以及在所述衬底的所述第一侧处的第三凹槽，其中所述浮动衬垫在所述第二凹槽与所述第三凹槽之间。本文中还公开了其它实例和相关方法。