MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS, PLUG, AND PLUG MANUFACTURING METHOD

The invention provides a member for a semiconductor manufacturing apparatus, a plug, and a plug manufacturing method. A gas flow path can be manufactured according to design, arc discharge in the gas flow path can be suppressed, and a sufficient gas flow rate can be ensured. A member (10) for a semi...

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Bibliographische Detailangaben
Hauptverfasser:	OHNO TADASHI, HASHIMOTO HIDEAKI, ASHIDA CHUDAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA METALLURGY PERFORMING OPERATIONS REFRACTORIES SEMICONDUCTOR DEVICES SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURESCONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER SLAG TRANSPORTING TREATMENT OF NATURAL STONE WORKING CEMENT, CLAY, OR STONE
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Beschreibung
Zusammenfassung:	The invention provides a member for a semiconductor manufacturing apparatus, a plug, and a plug manufacturing method. A gas flow path can be manufactured according to design, arc discharge in the gas flow path can be suppressed, and a sufficient gas flow rate can be ensured. A member (10) for a semiconductor manufacturing apparatus is provided with: a ceramic plate (20) having a wafer placement section (21) on the upper surface thereof; and a plug (50) that is provided in a plug installation hole (24) penetrating the ceramic plate (20) in the vertical direction and that allows the flow of gas. The plug (50) has a gas flow path (54) formed by combining a plurality of linear flow paths in a crossing manner in the interior of a plug main body (52). The gas flow path (54) has a plurality of openings in the upper surface and the lower surface of the plug body (52). 本发明提供半导体制造装置用部件、插塞以及插塞制造方法。能够按设计制作气体流路，且能够抑制气体流路内的电弧放电，并且，确保足够的气体流量。半导体制造装置用部件(10)具备：陶瓷板(20)，其上表面具有晶片载放部(21)；以及插塞(50)，其设置于沿上下方向贯穿陶瓷板(20)的插塞设置孔(24)，并容许气