Wafer physical self-alignment process method and wafer bonding structure

The invention belongs to the technical field of wafer self-alignment, and particularly relates to a wafer physical self-alignment process method and a wafer bonding structure. The self-alignment process method comprises the following steps: S1, preparing at least two inclined surface salient points...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG CHUTING, LU JICUN, CHEN FAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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