Wafer physical self-alignment process method and wafer bonding structure

The invention belongs to the technical field of wafer self-alignment, and particularly relates to a wafer physical self-alignment process method and a wafer bonding structure. The self-alignment process method comprises the following steps: S1, preparing at least two inclined surface salient points on a bonding surface of an upper wafer; s2, arranging inclined plane grooves in one-to-one fit with the inclined plane salient points on the bonding surface of the lower wafer; s3, pre-positioning is carried out between the upper wafer and the lower wafer; and S4, self-aligning the upper wafer and the lower wafer. According to the self-alignment process method, the upper wafer and the lower wafer are pre-positioned through the inclined surface convex points and the inclined surface grooves which are respectively arranged on the upper wafer and the lower wafer, self-positioning between the upper wafer and the lower wafer is realized by ingeniously utilizing the inclined surfaces, the self-alignment process method ca