Processing system, electrostatic carrier and processing method

A processing system for processing a chip, the processing system including a chip placement device that picks up the chip and arranges the chip on a suction surface of a first electrostatic carrier, the chip placement device including: a carrier holding portion for placement that holds the first electrostatic carrier, and a first electrostatic carrier holding portion that holds the first electrostatic carrier, the first electrostatic carrier holding portion holding the first electrostatic carrier, the first electrostatic carrier holding portion holding the first electrostatic carrier, the first electrostatic carrier holding portion holding the first electrostatic carrier, and the second electrostatic carrier holding portion holding the first electrostatic carrier; and a power supply unit that applies a voltage to the first electrostatic carrier held by the placement carrier holding unit. 一种处理系统，对芯片进行处理，该处理系统具有芯片配置装置，所述芯片配置装置对所述芯片进行拾取并将所述芯片排列配置于第一静电承载件的吸附面上，所述芯片配置装置具备：配置用承载件保持部，其保持所述第一静电承载件；以及电力供给部，其对被保持于所述配置用