Water-soluble flux and solder paste

The water-soluble flux capable of further suppressing the generation of voids according to the present invention contains a ketonic acid having a melting point of 40 DEG C or less and a solvent having a boiling point of 240 DEG C or less. 本发明的能够进一步抑制空隙的产生的水溶性助焊剂含有熔点为40℃以下的酮酸和沸点为240℃以下的溶剂。...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA SHOSEI, YAMAGAME TOMOHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The water-soluble flux capable of further suppressing the generation of voids according to the present invention contains a ketonic acid having a melting point of 40 DEG C or less and a solvent having a boiling point of 240 DEG C or less. 本发明的能够进一步抑制空隙的产生的水溶性助焊剂含有熔点为40℃以下的酮酸和沸点为240℃以下的溶剂。