Efficient and uniform heat dissipation bottom plate of HPD module

An efficient and uniform heat dissipation bottom plate of an HPD module comprises a heat dissipation bottom plate, a heat dissipation water channel covering the heat dissipation bottom plate, and a plurality of chips welded on the heat dissipation water channel. A plurality of sheet-shaped heat diss...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG HONGXIAO, WU RUI, CHEN WENCHAO, OU DONGYING, XU JIAHUI, TANG ZHUOFAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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