Composite material heat dissipation electronic module forming mold and method
The invention relates to a forming die and method for a composite heat dissipation electronic module. The forming die comprises a main die, a soldering paste printing tool and a welding tool. The method comprises the steps that a mold is cleaned, and a metal part is pre-embedded; paving an inner ski...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to a forming die and method for a composite heat dissipation electronic module. The forming die comprises a main die, a soldering paste printing tool and a welding tool. The method comprises the steps that a mold is cleaned, and a metal part is pre-embedded; paving an inner skin carbon fiber layer, an adhesive film, a foam layer and an outer skin carbon fiber layer; curing, molding, demolding and drilling to obtain a carbon fiber structural part assembly; printing lead-tin solder paste; and the uniform temperature plate is welded to the carbon fiber structural part assembly through a welding tool. According to the forming method, the metal heat dissipation conductive insert is pre-embedded and then co-cured with the carbon fiber structural body, so that the metal heat dissipation conductive insert is synchronously glued and embedded in the forming process of the carbon fiber structural body, and the static electricity transfer function of a grounding boss in the metal heat dissipation co |
---|