Resin sealing device and resin sealing method
The present invention addresses the problem of providing a resin sealing device and a resin sealing method capable of preventing the surface temperature of a sealing mold from gradually decreasing and causing poor molding when automatic operation is continued in a certain period. As a solution, the...
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| creator | NAKAYAMA EIJI TAKAHASHI HARUHISA |
| description | The present invention addresses the problem of providing a resin sealing device and a resin sealing method capable of preventing the surface temperature of a sealing mold from gradually decreasing and causing poor molding when automatic operation is continued in a certain period. As a solution, the resin sealing method of the present invention is configured such that the temperature of a sealing mold (202), which is set as a temperature at which a resin (R) is appropriately thermally hardened during sealing, is set as a normal set temperature, and the temperature of the sealing mold (202), which is set as a temperature higher than the normal set temperature by a predetermined temperature, is set as a switching set temperature. In a unit step in which a workpiece (W) and a resin (R) are loaded and sealed into a sealing mold (202) and then are loaded out as a molded article (Wp), for at least one of an upper mold (204) and a lower mold (206), the temperature of the sealing mold (202) is controlled by increasing |
| format | Patent |
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As a solution, the resin sealing method of the present invention is configured such that the temperature of a sealing mold (202), which is set as a temperature at which a resin (R) is appropriately thermally hardened during sealing, is set as a normal set temperature, and the temperature of the sealing mold (202), which is set as a temperature higher than the normal set temperature by a predetermined temperature, is set as a switching set temperature. 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As a solution, the resin sealing method of the present invention is configured such that the temperature of a sealing mold (202), which is set as a temperature at which a resin (R) is appropriately thermally hardened during sealing, is set as a normal set temperature, and the temperature of the sealing mold (202), which is set as a temperature higher than the normal set temperature by a predetermined temperature, is set as a switching set temperature. In a unit step in which a workpiece (W) and a resin (R) are loaded and sealed into a sealing mold (202) and then are loaded out as a molded article (Wp), for at least one of an upper mold (204) and a lower mold (206), the temperature of the sealing mold (202) is controlled by increasing</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Resin sealing device and resin sealing method |
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