Resin sealing device and resin sealing method

The present invention addresses the problem of providing a resin sealing device and a resin sealing method capable of preventing the surface temperature of a sealing mold from gradually decreasing and causing poor molding when automatic operation is continued in a certain period. As a solution, the resin sealing method of the present invention is configured such that the temperature of a sealing mold (202), which is set as a temperature at which a resin (R) is appropriately thermally hardened during sealing, is set as a normal set temperature, and the temperature of the sealing mold (202), which is set as a temperature higher than the normal set temperature by a predetermined temperature, is set as a switching set temperature. In a unit step in which a workpiece (W) and a resin (R) are loaded and sealed into a sealing mold (202) and then are loaded out as a molded article (Wp), for at least one of an upper mold (204) and a lower mold (206), the temperature of the sealing mold (202) is controlled by increasing