Circuit board, method of manufacturing same, and electronic component package including same

The present disclosure provides a circuit board, a method of manufacturing the same, and an electronic component package including the same. The circuit board includes: an insulating layer; a contact layer disposed on the first surface of the insulating layer; a connection layer including a connecti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM SANG-HOON, GAO YONGGUO, KIM HEA-SUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!