Circuit board, method of manufacturing same, and electronic component package including same

The present disclosure provides a circuit board, a method of manufacturing the same, and an electronic component package including the same. The circuit board includes: an insulating layer; a contact layer disposed on the first surface of the insulating layer; a connection layer including a connection portion embedded in the insulating layer and disposed on the contact layer; a via layer penetrating at least a portion of the insulating layer and connected to the connection layer; and a wiring layer disposed on a second surface of the insulating layer opposite to the first surface and connected to the via layer. The connection portion includes a first connection layer portion disposed on the contact layer and a second connection layer portion disposed on the first connection layer portion. The insulating layer includes a first portion in which the first connection layer portion is embedded and surrounds the first connection layer portion, and a second portion in which the second connection layer portion is emb