Bonding method
The invention provides a bonding method. The joining method for joining two separators comprises: a step for bringing a first separator (30) and a second separator (32) into contact with each other; a step in which a first electrode (90a) for welding is brought into contact with the plurality of fir...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a bonding method. The joining method for joining two separators comprises: a step for bringing a first separator (30) and a second separator (32) into contact with each other; a step in which a first electrode (90a) for welding is brought into contact with the plurality of first inner protrusions (46a); a step in which a second electrode (90b) for welding is brought into contact with the plurality of second inner protrusions (66a); and a step in which a current is caused to flow between the first electrode (90a) and the second electrode (90b) and a plurality of locations where the first outer protrusion (46b) and the second outer protrusion (66b) are in contact are welded. Therefore, the contact parts of two adjacent partition plates can be welded.
本发明提供一种接合方法。使2个隔板相接合的接合方法包括:使第1隔板(30)和第2隔板(32)彼此接触的工序;使焊接用的第1电极(90a)与多个第1内侧凸起部(46a)相接触的工序;使焊接用的第2电极(90b)与多个第2内侧凸起部(66a)相接触的工序;使电流在第1电极(90a)与第2电极(90b)之间流动而对第1外侧凸起部(46b)和第2外侧凸起部(66b)接触的多个部位进行焊接的工序。据此,能够对相邻的2个隔板彼此接触的部分进行焊接。 |
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