Semiconductor wafer segmentation method

The invention discloses a semiconductor wafer segmentation method, and relates to the technical field of intelligent manufacturing, and the method comprises the steps: determining a plurality of quality evaluation performances of a semiconductor; determining a plurality of segmentation process chains in one-to-one correspondence with the quality evaluation performance; determining a demand value of each quality evaluation performance of the currently processed semiconductor; establishing a quality evaluation performance-segmentation parameter regression prediction equation of each segmentation process chain; obtaining segmentation parameters of the completed segmentation process steps of the semiconductor in real time; calculating the probability value of the processed semiconductor meeting all the required values of the quality evaluation performance under the condition that the segmentation process steps are completed; and judging whether the segmentation qualification risk value is greater than a preset va