Cooling disc, filling cavity and wafer processing equipment

The invention provides a cooling disc for a filling cavity, the filling cavity and wafer processing equipment. A wafer is placed above a cooling disc used for filling a cavity, the upper surface of the cooling disc is provided with a plurality of contact points used for supporting the wafer, a cooling water pipeline is arranged in the cooling disc, the cooling water pipeline is distributed in the cooling disc in a bending mode, and cooling water is introduced into the cooling water pipeline to cool the wafer. According to the cooling disc for the filling cavity, the filling cavity and the wafer processing equipment provided by the invention, a wafer which is just processed can be rapidly, controllably and safely cooled. 本发明提供了一种用于装填腔的冷却盘、一种装填腔以及一种晶圆加工设备。晶圆放置于用于装填腔的冷却盘上方，冷却盘的上表面设有用于支撑晶圆的多个接触点，冷却盘的内部设有冷却水管路，冷却水管路弯绕地分布在冷却盘内，冷却水管路中通入冷却水以冷却晶圆。本发明提供的一种用于装填腔的冷却盘、一种装填腔以及一种晶圆加工设备，能够实现对刚加工完成的晶圆进行快速、可控、安全的降温。