Semiconductor manufacturing apparatus, tool jig mounting method, and semiconductor device manufacturing method

The invention provides a technology capable of preventing a tool clamp which does not correspond to a product from being installed. The semiconductor manufacturing apparatus includes: a tool jig having a label; a bare chip processing unit, wherein the tool clamp can be installed on the bare chip processing unit in a replaceable manner; a reader/writer that reads data from the tag or writes data to the tag; and a control device configured to compare the data read from the tag with data held in advance, and not start production when the comparison results do not match. 本发明提供一种能够防止安装与产品不对应的工装夹具的技术。半导体制造装置包括：工装夹具，其具有标签；裸芯片处理单元，所述工装夹具能够更换地安装于所述裸芯片处理单元；读写器，其从所述标签读取数据或向所述标签写入数据；以及控制装置，其构成为将从所述标签读取的数据与预先保持的数据进行比较，在比较结果不一致的情况下不开始生产。