Apparatus for bonding substrates, apparatus for transferring electronic components, and method for welding same

The invention provides a device for laminating a substrate. The device comprises a first bearing frame, a second bearing frame, a driving mechanism and a substrate adjusting mechanism, the first bearing frame is used for bearing a first substrate and is provided with a first bearing surface. The second bearing frame is used for bearing a second substrate and is provided with a second bearing surface. The driving mechanism can enable the first bearing frame and the second bearing frame to move close to each other and away from each other. The substrate adjusting mechanism can enable the carried first substrate and second substrate to be configured in a non-parallel manner. The invention also provides an apparatus for transferring an electronic component, a method for welding an electronic component, and a method for manufacturing a light emitting diode display. The device provided by the invention can be used for fitting the substrate, the equipment provided by the invention can be used for transferring the el