Spill-proof plastic packaging device for chip

The invention discloses an anti-overflow plastic packaging device for chips, and relates to the technical field of chip packaging, the anti-overflow plastic packaging device comprises a mounting frame, a rotating disc is rotatably arranged at the bottom of the mounting frame, and a plastic packaging...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DING DUOYONG, SHI JIAKUI, LU KUN, LU YUANJIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses an anti-overflow plastic packaging device for chips, and relates to the technical field of chip packaging, the anti-overflow plastic packaging device comprises a mounting frame, a rotating disc is rotatably arranged at the bottom of the mounting frame, and a plastic packaging structure is arranged in the rotating disc; through the arrangement of the flash groove, the injection molding equipment performs excessive injection molding on the interior of the plastic package groove, so that the chip can be subjected to plastic package, and excessive plastic enters the flash groove; the cutter at the bottom of the upper mold cuts the plastic in the flash groove after injection molding is completed, so that subsequent taking of a complete plastic package chip and cleaning of the plastic in the flash groove are facilitated; the mounting frame is arranged, and the air cylinder drives the mounting frame to move in the vertical direction, so that the distance between the mounting frame and the bot