Jig and method suitable for high-temperature electric aging screening of surface-mounted electronic components

The invention relates to a jig and method suitable for high-temperature electric aging screening of surface-mounted electronic components, and the jig suitable for high-temperature electric aging screening of the surface-mounted electronic components comprises a plane base, mounting positions are arranged on the plane base in an array mode, first positioning holes are correspondingly formed in the two sides of each mounting position, and second positioning holes are formed in the two sides of each mounting position; an identification placing frame is arranged at the mounting position; a high-temperature double-sided tape is arranged on the surface of the planar base, and the electronic element is adhered to the high-temperature double-sided tape; the electrode plate is connected with the electronic element; the base is suitable for chip component products of different specifications and sizes and is not only suitable for chip components connected in series, and electric aging is carried out by using a constan