Printed circuit board and manufacturing method thereof

The present disclosure provides a printed circuit board and a method of manufacturing the same, the printed circuit board including: an insulating layer having a first surface and a second surface opposite to each other; a first connection pad embedded in the insulating layer and having a surface recessed from the first surface of the insulating layer; a conductive layer on the first connection pad and having a portion embedded in the insulating layer and another portion protruding from the first surface of the insulating layer; and a first solder resist layer on the first surface of the insulating layer, and a height of a surface of the first solder resist layer is equal to or lower than a height of a surface of the conductive layer. 本公开提供一种印刷电路板及其制造方法，所述印刷电路板包括：绝缘层，具有彼此相对的第一表面和第二表面；第一连接焊盘，嵌在所述绝缘层中并且具有从所述绝缘层的所述第一表面凹入的表面；导电层，位于所述第一连接焊盘上，并且具有嵌在所述绝缘层中的部分和从所述绝缘层的所述第一表面突出的另一部分；以及第一阻焊剂层，位于所述绝缘层的所述第一表面上，并且所述第一阻焊剂层的表面的高度等于或低于所述导电层的表面的高度。