Semiconductor device, semiconductor package and method of forming same

A method of manufacturing a semiconductor package includes providing a semiconductor chip having a plurality of first connection structures disposed on a topmost metallization layer of a plurality of metallization layers. The method includes forming a redistribution structure including a plurality of conductive layers and a plurality of via structures, adjacent conductive layers of the plurality of conductive layers being connected by at least a corresponding one of the plurality of via structures. The method includes joining a plurality of first connector structures to a redistribution structure. The method includes bonding a redistribution structure to a carrier substrate through a plurality of second connection structures. Forming the redistribution structure includes laterally rotating a first via structure of the plurality of via structures about a second via structure of the plurality of via structures, the first via structure vertically over the second via structure. The embodiment of the invention als