Polymer adhesive for chip processing and preparation method thereof

The invention belongs to the field of adhesives, particularly relates to the field of C09J7/00, and more particularly relates to a macromolecular adhesive capable of being used for chip processing and a preparation method of the macromolecular adhesive. The adhesive is prepared from the following ra...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YE ZHIQUN, LIANG DANHUI, LU YANBING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!