Polymer adhesive for chip processing and preparation method thereof

The invention belongs to the field of adhesives, particularly relates to the field of C09J7/00, and more particularly relates to a macromolecular adhesive capable of being used for chip processing and a preparation method of the macromolecular adhesive. The adhesive is prepared from the following raw materials in parts by mass: 75-90 parts of an acrylic resin solution, 5-20 parts of a compounding agent and 1-3 parts of a curing accelerator; wherein the preparation raw materials of the acrylic resin solution comprise a reaction monomer, a solvent and an initiator, the viscosity of the acrylic resin solution is 10000-30000 mPas, and the number-average molecular weight of the acrylic resin solution is 100000-400000; the compounding agent is prepared from resin, filler and a compounding agent solvent; the curing accelerator is an imidazole compound. The adhesive provided by the invention is excellent in mechanical property, moderate in viscosity, peelable after being cured, and especially suitable for chip bondin