Cooling plate
The invention relates to a cooling plate (1) for a cooling device (10) through which a fluid can flow for cooling a power electronic device (200). The cooling plate (1) comprises a base body (2) and a plurality of cooling ribs (3) protruding from the base body (2). The surface (20) of the base body...
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| creator | RIES-MUELLER KLAUS |
| description | The invention relates to a cooling plate (1) for a cooling device (10) through which a fluid can flow for cooling a power electronic device (200). The cooling plate (1) comprises a base body (2) and a plurality of cooling ribs (3) protruding from the base body (2). The surface (20) of the base body (2) and/or the surface (30) of the at least one cooling rib (3) has at least one defined microstructured region (4). Further aspects of the invention relate to such a cooler (10) and a power electronics arrangement (100).
本发明涉及一种用于冷却功率电子器件(200)的能流体穿流的冷却器(10)的冷却板(1)。冷却板(1)包括基体(2)和从基体(2)突出的多个冷却肋(3)。在此，基体(2)的表面(20)和/或至少一个冷却肋(3)的表面(30)具有至少一个规定的微观结构化的区域(4)。本发明的另外的方面涉及这类冷却器(10)以及一种功率电子器件布置结构(100)。 |
| format | Patent |
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本发明涉及一种用于冷却功率电子器件(200)的能流体穿流的冷却器(10)的冷却板(1)。冷却板(1)包括基体(2)和从基体(2)突出的多个冷却肋(3)。在此，基体(2)的表面(20)和/或至少一个冷却肋(3)的表面(30)具有至少一个规定的微观结构化的区域(4)。本发明的另外的方面涉及这类冷却器(10)以及一种功率电子器件布置结构(100)。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240607&DB=EPODOC&CC=CN&NR=118160421A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240607&DB=EPODOC&CC=CN&NR=118160421A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RIES-MUELLER KLAUS</creatorcontrib><title>Cooling plate</title><description>The invention relates to a cooling plate (1) for a cooling device (10) through which a fluid can flow for cooling a power electronic device (200). The cooling plate (1) comprises a base body (2) and a plurality of cooling ribs (3) protruding from the base body (2). The surface (20) of the base body (2) and/or the surface (30) of the at least one cooling rib (3) has at least one defined microstructured region (4). Further aspects of the invention relate to such a cooler (10) and a power electronics arrangement (100).
本发明涉及一种用于冷却功率电子器件(200)的能流体穿流的冷却器(10)的冷却板(1)。冷却板(1)包括基体(2)和从基体(2)突出的多个冷却肋(3)。在此，基体(2)的表面(20)和/或至少一个冷却肋(3)的表面(30)具有至少一个规定的微观结构化的区域(4)。本发明的另外的方面涉及这类冷却器(10)以及一种功率电子器件布置结构(100)。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB1zs_PycxLVyjISSxJ5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWhmYGJkaGjsbEqAEAJfwd5Q</recordid><startdate>20240607</startdate><enddate>20240607</enddate><creator>RIES-MUELLER KLAUS</creator><scope>EVB</scope></search><sort><creationdate>20240607</creationdate><title>Cooling plate</title><author>RIES-MUELLER KLAUS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118160421A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>RIES-MUELLER KLAUS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RIES-MUELLER KLAUS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cooling plate</title><date>2024-06-07</date><risdate>2024</risdate><abstract>The invention relates to a cooling plate (1) for a cooling device (10) through which a fluid can flow for cooling a power electronic device (200). The cooling plate (1) comprises a base body (2) and a plurality of cooling ribs (3) protruding from the base body (2). The surface (20) of the base body (2) and/or the surface (30) of the at least one cooling rib (3) has at least one defined microstructured region (4). Further aspects of the invention relate to such a cooler (10) and a power electronics arrangement (100).
本发明涉及一种用于冷却功率电子器件(200)的能流体穿流的冷却器(10)的冷却板(1)。冷却板(1)包括基体(2)和从基体(2)突出的多个冷却肋(3)。在此，基体(2)的表面(20)和/或至少一个冷却肋(3)的表面(30)具有至少一个规定的微观结构化的区域(4)。本发明的另外的方面涉及这类冷却器(10)以及一种功率电子器件布置结构(100)。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Cooling plate |
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