Cooling plate
The invention relates to a cooling plate (1) for a cooling device (10) through which a fluid can flow for cooling a power electronic device (200). The cooling plate (1) comprises a base body (2) and a plurality of cooling ribs (3) protruding from the base body (2). The surface (20) of the base body...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to a cooling plate (1) for a cooling device (10) through which a fluid can flow for cooling a power electronic device (200). The cooling plate (1) comprises a base body (2) and a plurality of cooling ribs (3) protruding from the base body (2). The surface (20) of the base body (2) and/or the surface (30) of the at least one cooling rib (3) has at least one defined microstructured region (4). Further aspects of the invention relate to such a cooler (10) and a power electronics arrangement (100).
本发明涉及一种用于冷却功率电子器件(200)的能流体穿流的冷却器(10)的冷却板(1)。冷却板(1)包括基体(2)和从基体(2)突出的多个冷却肋(3)。在此，基体(2)的表面(20)和/或至少一个冷却肋(3)的表面(30)具有至少一个规定的微观结构化的区域(4)。本发明的另外的方面涉及这类冷却器(10)以及一种功率电子器件布置结构(100)。 |
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