SEMICONDUCTOR PACKAGE

A semiconductor package is provided. The semiconductor package includes a lower chip. A chip stack structure is disposed on the lower chip. The chip stacking structure comprises a plurality of upper chips. An underfill layer is disposed between the lower chip and the chip stack structure and between...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HA SUNG-MOK, CHOI IL-JOO, ROH HYUNG-GYUN, BAE JIN-SOO, BAE KUN-HEE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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