Substrate heat treatment apparatus and substrate heat treatment method

The invention provides a substrate heat treatment apparatus and a substrate heat treatment method. When a substrate is sucked through a plurality of suction ports provided on the upper surface of a hot plate, suction paths for performing the suction and the suction ports are easily connected. The substrate heat treatment apparatus includes: a heat plate; a plurality of suction ports provided on the upper surface of the heat plate; an exhaust path forming part provided with a separation part formed below the hot plate so as to be separated from the hot plate, a plurality of opening parts provided in the separation part, and an exhaust path connected to each opening part; a height displacement part which is variable in height with respect to the exhaust path formation part, protrudes above the separation part, and is provided to each opening part; the connecting parts are respectively connected with the upper sides of the height displacement parts; a suction path provided from the upper end of the connection pa