Photoresist coating structure and photoresist coating method
The invention provides a photoresist coating structure and a photoresist coating method, so that the photoresist coating structure and the photoresist coating method are suitable for the manufacturing process of a wafer with a step on the edge, specifically, the wafer comprises a main body part and...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ZHU SHENGBING XUE XINGTAO DAI YUQIANG |
| description | The invention provides a photoresist coating structure and a photoresist coating method, so that the photoresist coating structure and the photoresist coating method are suitable for the manufacturing process of a wafer with a step on the edge, specifically, the wafer comprises a main body part and a peripheral part, and the upper surface of the peripheral part is lower than the upper surface of the main body part. During coating, an annular first photoresist layer is formed on the peripheral part of the wafer, and the first photoresist layer wraps the outer side wall of the main body part and extends to the upper surface of the main body part in the radial direction. The edge and corner of the step are covered by the annular first photoresist layer, and then the second photoresist layer is formed on the main body part through coating, so that the coating range of the second photoresist layer is limited, the flatness of the second photoresist layer is ensured, bubbles and cracks of the second photoresist laye |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118151493A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118151493A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118151493A3</originalsourceid><addsrcrecordid>eNrjZLAJyMgvyS9KLc4sLlFIzk8sycxLVyguKSpNLiktSlVIzEtRKMCiIje1JCM_hYeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxDv7GRpaGJoamlgaOxoTowYAW-UwvA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photoresist coating structure and photoresist coating method</title><source>esp@cenet</source><creator>ZHU SHENGBING ; XUE XINGTAO ; DAI YUQIANG</creator><creatorcontrib>ZHU SHENGBING ; XUE XINGTAO ; DAI YUQIANG</creatorcontrib><description>The invention provides a photoresist coating structure and a photoresist coating method, so that the photoresist coating structure and the photoresist coating method are suitable for the manufacturing process of a wafer with a step on the edge, specifically, the wafer comprises a main body part and a peripheral part, and the upper surface of the peripheral part is lower than the upper surface of the main body part. During coating, an annular first photoresist layer is formed on the peripheral part of the wafer, and the first photoresist layer wraps the outer side wall of the main body part and extends to the upper surface of the main body part in the radial direction. The edge and corner of the step are covered by the annular first photoresist layer, and then the second photoresist layer is formed on the main body part through coating, so that the coating range of the second photoresist layer is limited, the flatness of the second photoresist layer is ensured, bubbles and cracks of the second photoresist laye</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240607&DB=EPODOC&CC=CN&NR=118151493A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240607&DB=EPODOC&CC=CN&NR=118151493A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHU SHENGBING</creatorcontrib><creatorcontrib>XUE XINGTAO</creatorcontrib><creatorcontrib>DAI YUQIANG</creatorcontrib><title>Photoresist coating structure and photoresist coating method</title><description>The invention provides a photoresist coating structure and a photoresist coating method, so that the photoresist coating structure and the photoresist coating method are suitable for the manufacturing process of a wafer with a step on the edge, specifically, the wafer comprises a main body part and a peripheral part, and the upper surface of the peripheral part is lower than the upper surface of the main body part. During coating, an annular first photoresist layer is formed on the peripheral part of the wafer, and the first photoresist layer wraps the outer side wall of the main body part and extends to the upper surface of the main body part in the radial direction. The edge and corner of the step are covered by the annular first photoresist layer, and then the second photoresist layer is formed on the main body part through coating, so that the coating range of the second photoresist layer is limited, the flatness of the second photoresist layer is ensured, bubbles and cracks of the second photoresist laye</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAJyMgvyS9KLc4sLlFIzk8sycxLVyguKSpNLiktSlVIzEtRKMCiIje1JCM_hYeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxDv7GRpaGJoamlgaOxoTowYAW-UwvA</recordid><startdate>20240607</startdate><enddate>20240607</enddate><creator>ZHU SHENGBING</creator><creator>XUE XINGTAO</creator><creator>DAI YUQIANG</creator><scope>EVB</scope></search><sort><creationdate>20240607</creationdate><title>Photoresist coating structure and photoresist coating method</title><author>ZHU SHENGBING ; XUE XINGTAO ; DAI YUQIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118151493A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHU SHENGBING</creatorcontrib><creatorcontrib>XUE XINGTAO</creatorcontrib><creatorcontrib>DAI YUQIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHU SHENGBING</au><au>XUE XINGTAO</au><au>DAI YUQIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photoresist coating structure and photoresist coating method</title><date>2024-06-07</date><risdate>2024</risdate><abstract>The invention provides a photoresist coating structure and a photoresist coating method, so that the photoresist coating structure and the photoresist coating method are suitable for the manufacturing process of a wafer with a step on the edge, specifically, the wafer comprises a main body part and a peripheral part, and the upper surface of the peripheral part is lower than the upper surface of the main body part. During coating, an annular first photoresist layer is formed on the peripheral part of the wafer, and the first photoresist layer wraps the outer side wall of the main body part and extends to the upper surface of the main body part in the radial direction. The edge and corner of the step are covered by the annular first photoresist layer, and then the second photoresist layer is formed on the main body part through coating, so that the coating range of the second photoresist layer is limited, the flatness of the second photoresist layer is ensured, bubbles and cracks of the second photoresist laye</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN118151493A |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | Photoresist coating structure and photoresist coating method |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T04%3A31%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHU%20SHENGBING&rft.date=2024-06-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118151493A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |