Photoresist coating structure and photoresist coating method

The invention provides a photoresist coating structure and a photoresist coating method, so that the photoresist coating structure and the photoresist coating method are suitable for the manufacturing process of a wafer with a step on the edge, specifically, the wafer comprises a main body part and...

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Bibliographische Detailangaben
Hauptverfasser: ZHU SHENGBING, XUE XINGTAO, DAI YUQIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a photoresist coating structure and a photoresist coating method, so that the photoresist coating structure and the photoresist coating method are suitable for the manufacturing process of a wafer with a step on the edge, specifically, the wafer comprises a main body part and a peripheral part, and the upper surface of the peripheral part is lower than the upper surface of the main body part. During coating, an annular first photoresist layer is formed on the peripheral part of the wafer, and the first photoresist layer wraps the outer side wall of the main body part and extends to the upper surface of the main body part in the radial direction. The edge and corner of the step are covered by the annular first photoresist layer, and then the second photoresist layer is formed on the main body part through coating, so that the coating range of the second photoresist layer is limited, the flatness of the second photoresist layer is ensured, bubbles and cracks of the second photoresist laye